Samsung is expected to more than double output of its HBM4 and HBM4E DRAM

en.sedaily.com

224 points by giuliomagnifico 4 hours ago


HarHarVeryFunny - an hour ago

On a related note, I was reading yesterday that apparently the real bottleneck for Chinese production of AI accelerators is HBM production, not processors or ASML equipment.

The lack of ASML EUV machines certainly hurts, and pushing DUV so hard results in abysmal yields of good chips, but you can compensate by running more wafers or making smaller chips, and the net result is that Huawei's Ascend production volume is limited by CXMT's HBM capacity not processor dies.

The problem is that HBM manufacture requires many steps (die thinning, via drilling, plating, alignment) where the equipment used by everyone else (Samsung, SK Hynix, Micron) is also blocked by sanctions, so the Chinese are having to develop all of this themselves too, which they have, but yields are currently low, even when using shorter HBM stacks.

fooker - 3 hours ago

What's the main blocker (other than the current inflated cost) for using HBM instead of DRAM as the primary memory for consumer electronics?

gs17 - 3 hours ago

A shame that this should if anything, lead to consumer DRAM prices getting even worse.

amelius - 3 hours ago

Will that be enough for AI's hunger?